Abstract
The changing demands in terms of the compactness and performance of electronic devices increase the role of thermal management within this application field. Because polymers and especially thermosets have a low thermal conductivity, filler systems have to be used to improve their performance and make thermosets suitable for applications. So far, several factors influencing thermal conductivity have been defined; however, the combined investigation of mechanical properties as another important value in terms of applications has not been realized. Therefore, this paper analyzes thermal conductivity based on the orientation of fillers and a contact path as well as mechanical properties in different material systems. In addition to the matrix material, the filler type and grade and the geometry and size were varied. It was shown that boron nitride provides the best values in terms of thermal conductivity after orientation along the flow path is realized. An aluminum silicate was defined as the best filler system in terms of mechanical properties. However, the boron nitride was found to reveal the greatest potential in terms of applications, since the mechanical properties are likely to be increased by the usage of finishing additives such as silane.