Abstract
This study evaluated the effects and mechanism of shikimic acid braising on the gelling characteristics of heat-induced egg white gel (HEWG). The results indicated that, during braising, soluble protein and hardness showed an overall increasing trend. The absolute Zeta potential value showed a decreasing trend; however, T2 and free sulfhydryl group showed an increasing trend first and decreasing trend later, and surface hydrophobicity showed a decreasing trend. Microstructure analysis showed that protein gel aggregation increased and that holes and cracks formed first, and then the cracks decreased. Fourier transform infrared spectrometry showed that shikimic acid could strengthen the polarity of HEWG, and a mutual transformation occurred between intramolecular β-sheets, intermolecular β-sheets, and intermolecular antiparallel β-sheets, as well as a slight blue-shift, in the α-helices. In general, the addition of shikimic acid could alter the HEWG structure and improve its gel strength, polarity, and aggregation. Moreover, the higher the concentration of shikimic acid, the greater the influence on HEWG. Therefore, shikimic acid could be used as a new type of gel enhancer for the modification of egg white gel.