Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO(2), and Silicon-EMC) Found in Microchips
热变化对微芯片中双材料界面(聚酰亚胺-EMC、聚酰亚胺-SiO₂和硅-EMC)疲劳和断裂的影响
期刊:Polymers
影响因子:4.9
doi:10.3390/polym17040520
Videira, Pedro F C; Ferreira, Renato A; Maleki, Payam; Akhavan-Safar, Alireza; Carbas, Ricardo J C; Marques, Eduardo A S; Karunamurthy, Bala; da Silva, Lucas F M