日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis

多次回流焊对Sn-3.5Ag焊料中一次晶体形成及焊点强度的影响:实验和有限元分析

Amli, Siti Farahnabilah Muhd; Salleh, Mohd Arif Anuar Mohd; Aziz, Mohd Sharizal Abdul; Yasuda, Hideyuki; Nogita, Kazuhiro; Abdullah, Mohd Mustafa Al Bakri; Nemes, Ovidiu; Sandu, Andrei Victor; Vizureanu, Petrica

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

无铅焊点中金属间化合物的形成与生长:综述

Ramli, Mohd Izrul Izwan; Salleh, Mohd Arif Anuar Mohd; Abdullah, Mohd Mustafa Al Bakri; Zaimi, Nur Syahirah Mohamad; Sandu, Andrei Victor; Vizureanu, Petrica; Rylski, Adam; Amli, Siti Farahnabilah Muhd

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

1.5 wt.% Bi 对等温退火后 Sn-0.7Cu 焊点微观结构、硬度和剪切强度的影响

Ramli, Mohd Izrul Izwan; Salleh, Mohd Arif Anuar Mohd; Sandu, Andrei Victor; Amli, Siti Farahnabilah Muhd; Said, Rita Mohd; Saud, Norainiza; Abdullah, Mohd Mustafa Al Bakri; Vizureanu, Petrica; Rylski, Adam; Chaiprapa, Jitrin; Nabialek, Marcin