日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

通过自焊接、自涂覆和自修复实现超可拉伸芯片集成电路的可逆聚合物-凝胶转变

Lopes, Pedro Alhais; Santos, Bruno C; de Almeida, Anibal T; Tavakoli, Mahmoud