日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.

高压微冷却器件阳极和金-金热压硅晶片键合方法的比较

Bargiel Sylwester, Cogan Julien, Queste Samuel, Oliveri Stefania, Gauthier-Manuel Ludovic, Raschetti Marina, Leroy Olivier, Beurthey Stéphan, Perrin-Terrin Mathieu

Microfluidics for High Pressure: Integration on GaAs Acoustic Biosensors with a Leakage-Free PDMS Based on Bonding Technology

用于高压的微流控技术:基于键合技术的无泄漏PDMS与GaAs声学生物传感器的集成

Hammami, Saber; Oseev, Aleksandr; Bargiel, Sylwester; Zeggari, Rabah; Elie-Caille, Céline; Leblois, Thérèse

Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components

用于微型扫描器和微光学元件垂直多晶圆集成的技术平台

Bargiel, Sylwester; Baranski, Maciej; Wiemer, Maik; Frömel, Jörg; Wang, Wei-Shan; Gorecki, Christophe

Design and Fabrication of a 2-Axis Electrothermal MEMS Micro-Scanner for Optical Coherence Tomography

用于光学相干断层扫描的双轴电热MEMS微扫描器的设计与制造

Gioffré, Mariano; Coppola, Giuseppe; Iodice, Mario; Casalino, Maurizio; Tanguy, Quentin A A; Bargiel, Sylwester; Xie, Huikai; Passilly, Nicolas; Barthès, Magali; Gaiffe, Olivier; Rutkowski, Jaroslaw; Lutz, Philippe; Gorecki, Christophe