In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu-Cu Joints at High Current Density
高电流密度下铜-铜接头电迁移行为的原位原子尺度研究
期刊:ACS Nano
影响因子:16
doi:10.1021/acsnano.5c07534
Huang, Hua-Jing; Wang, Chien-Hua; Wang, Che-Hung; Shen, Fang-Chun; Yang, Shih-Chi; Ong, Jia-Juen; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chen, Chih; Wu, Wen-Wei