日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

A three-dimensional bipolar microneedle electrode array with local ground integrated at each sidewall for enhanced focal electric stimulation

一种三维双极微针电极阵列,其每个侧壁集成局部接地,用于增强局部电刺激。

Chung, Seung-Han; Kim, Chaesung; Kim, Minju; Choi, Donggeun; Son, Yunseo; Roh, Hyeonhee; Lee, Byung Chul; Lee, Hyung-Min; Kim, Yong-Kweon; Lee, Seung-Ki; Park, Jae-Hyoung; Im, Maesoon

Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications.

用于毫米波应用的玻璃基板集成波导,带有真空填充锡通孔

Chung Seung-Han, Yeom Ho-Sun, Kim Che-Heung, Kim Yong-Kweon, Lee Seung-Ki, Baek Chang-Wook, Park Jae-Hyoung

Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications

利用光刻蚀玻璃基板微加工技术制备基板集成波导,用于5G毫米波应用

Chung, Seung-Han; Shin, Jae-Hyun; Kim, Yong-Kweon; Baek, Chang-Wook