Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization
SMT无铅焊点的热致界面力学响应分析及其自适应优化
期刊:Micromachines
影响因子:3
doi:10.3390/mi13060908
Liu, Shaoyi; Yan, Yuefei; Zhou, Yijiang; Han, Baoqing; Wang, Benben; Zhang, Daxing; Xue, Song; Wang, Zhihai; Yu, Kunpeng; Shi, Yu; Wang, Congsi