Small-size temperature/high-pressure integrated sensor via flip-chip method
采用倒装芯片法的小型化温度/高压集成传感器
期刊:Microsystems & Nanoengineering
影响因子:9.9
doi:10.1038/s41378-024-00723-3
Huang, Mimi; Wu, Xiaoyu; Zhao, Libo; Han, Xiangguang; Xia, Yong; Gao, Yi; Cui, Zeyu; Zhang, Cheng; Yang, Xiaokai; Qiao, Zhixia; Li, Zhikang; Han, Feng; Yang, Ping; Jiang, Zhuangde