日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Scanning electron microscopy (SEM) evaluation of sealing ability of MTA and EndoSequence as root-end filling materials with chitosan and carboxymethyl chitosan (CMC) as retrograde smear layer removing agents

采用扫描电子显微镜 (SEM) 评估 MTA 和 EndoSequence 作为根尖充填材料的封闭性能,并以壳聚糖和羧甲基壳聚糖 (CMC) 作为逆行涂抹层去除剂。

Nagesh, Bolla; Jeevani, Eppala; Sujana, Varri; Damaraju, Bharagavi; Sreeha, Kaluvakolanu; Ramesh, Penumaka

"Evaluation of sealing ability of MM-MTA, Endosequence, and biodentine as furcation repair materials: UV spectrophotometric analysis"

“MM-MTA、Endosequence 和 biodentine 作为根分叉修复材料的封闭性能评价:紫外分光光度分析”

Jeevani, Eppala; Jayaprakash, Thumu; Bolla, Nagesh; Vemuri, Sayesh; Sunil, Chukka Ram; Kalluru, Rama S