Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
在空气环境中,通过超快表面晶粒生长实现低温铜-铜直接键合
期刊:Royal Society Open Science
影响因子:2.9
doi:10.1098/rsos.240459
Lee, Yun-Fong; Huang, Yu-Chen; Chang, Jui-Sheng; Cheng, Ting-Yi; Chen, Po-Yu; Huang, Wei-Chieh; Lo, Mei-Hsin; Fu, Kuan-Lin; Lai, Tse-Lin; Chang, Po-Kai; Yu, Zhong-Yen; Liu, Cheng-Yi