Interferometric mapping of material properties using thermal perturbation
利用热扰动干涉测量材料特性
期刊:Proceedings of the National Academy of Sciences of the United States of America
影响因子:
doi:10.1073/pnas.1712763115
Georges Goetz, Tong Ling, Tushar Gupta, Seungbum Kang, Jenny Wang, Patrick D Gregory, B Hyle Park, Daniel Palanker
