日期 影响因子
日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:
–

Ultrasound-transparent neural interfaces for multimodal interaction

用于多模态交互的超透明神经接口

期刊:npj Flexible Electronics
影响因子:15.5
doi:10.1038/s41528-025-00517-1
Panskus, Raphael; Velea, Andrada Iulia; Holzapfel, Lukas; Pavlou, Christos; Li, Qingying; Qin, Chaoyi; Nelissen, Flora; Waasdorp, Rick; Maresca, David; Gazzola, Valeria; Giagka, Vasiliki
发表日期：2026
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Transparent Transfer-Free Ultrasmall Multilayer Graphene Microelectrodes Enable High Quality Recordings in Brain Slices

透明免转移超小型多层石墨烯微电极可实现脑切片的高质量记录

期刊:Advanced Science
影响因子:14.1
doi:10.1002/advs.202517524
de Alvarez de Eulate, Nerea; Pavlou, Christos; León González, Gonzalo; Camarena Pérez, María; Holzapfel, Lukas; Gao, Zhenyu; Vollebregt, Sten; Giagka, Vasiliki
神经科学
发表日期：2026
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Author Correction: On the longevity and inherent hermeticity of silicon-ICs: evaluation of bare-die and PDMS-coated ICs after accelerated aging and implantation studies

作者更正：关于硅集成电路的寿命和固有密封性：加速老化和注入研究后裸芯片和PDMS涂层集成电路的评估

期刊:Nature Communications
影响因子:15.7
doi:10.1038/s41467-025-57175-0
Nanbakhsh, Kambiz; Shah Idil, Ahmad; Lamont, Callum; Dücső, Csaba; Akgun, Ömer Can; Horváth, Domonkos; Tóth, Kinga; Meszéna, Domokos; Ulbert, István; Mazza, Federico; Constandinou, Timothy G; Serdijn, Wouter; Vanhoestenberghe, Anne; Donaldson, Nick; Giagka, Vasiliki
衰老
多发性硬化症
发表日期：2025
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On the longevity and inherent hermeticity of silicon-ICs: evaluation of bare-die and PDMS-coated ICs after accelerated aging and implantation studies

关于硅集成电路的寿命和固有密封性：加速老化和注入研究后裸芯片和PDMS涂层集成电路的评估

期刊:Nature Communications
影响因子:15.7
doi:10.1038/s41467-024-55298-4
Nanbakhsh, Kambiz; Shah Idil, Ahmad; Lamont, Callum; Dücső, Csaba; Akgun, Ömer Can; Horváth, Domonkos; Tóth, Kinga; Meszéna, Domokos; Ulbert, István; Mazza, Federico; Constandinou, Timothy G; Serdijn, Wouter; Vanhoestenberghe, Anne; Donaldson, Nick; Giagka, Vasiliki
衰老
多发性硬化症
发表日期：2025
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An In Vivo Biostability Evaluation of ALD and Parylene-ALD Multilayers as Micro-Packaging Solutions for Small Single-Chip Implants

ALD和聚对二甲苯-ALD多层膜作为小型单芯片植入微封装解决方案的体内生物稳定性评价

期刊:Small
影响因子:12.1
doi:10.1002/smll.202410141
Nanbakhsh, Kambiz; Van Gompel, Matthias; Ritasalo, Riina; Gollhardt, Astrid; Horváth, Domonkos; Tóth, Kinga; Meszéna, Domokos; Ulbert, István; Serdijn, Wouter; Giagka, Vasiliki
发表日期：2025
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Multilayer CVD graphene electrodes using a transfer-free process for the next generation of optically transparent and MRI-compatible neural interfaces

采用无转移工艺的多层CVD石墨烯电极，用于下一代光学透明且与MRI兼容的神经接口

期刊:Microsystems & Nanoengineering
影响因子:9.9
doi:10.1038/s41378-022-00430-x
Bakhshaee Babaroud, Nasim; Palmar, Merlin; Velea, Andrada Iulia; Coletti, Chiara; Weingärtner, Sebastian; Vos, Frans; Serdijn, Wouter A; Vollebregt, Sten; Giagka, Vasiliki
发表日期：2022
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Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

基于液晶聚合物的柔性生物电子植入物薄膜封装：不同涂层材料寿命评估测试方法比较

期刊:Micromachines
影响因子:3
doi:10.3390/mi13040544
Pak, Anna; Nanbakhsh, Kambiz; Hölck, Ole; Ritasalo, Riina; Sousa, Maria; Van Gompel, Matthias; Pahl, Barbara; Wilson, Joshua; Kallmayer, Christine; Giagka, Vasiliki
发表日期：2022
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Focused ultrasound neuromodulation on a multiwell MEA

聚焦超声神经调控在多孔微电极阵列上的应用

期刊:Bioelectronic Medicine
影响因子:
doi:10.1186/s42234-021-00083-7
Saccher, Marta; Kawasaki, Shinnosuke; Onori, Martina Proietti; van Woerden, Geeske M; Giagka, Vasiliki; Dekker, Ronald
信号转导
发表日期：2022
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Silicone encapsulation of thin-film SiOx, SiOxNyand SiC for modern electronic medical implants: a comparative long-term ageing study

用于现代电子医疗植入物的 SiOx、SiOxNy 和 SiC 薄膜的硅胶封装：长期老化比较研究

期刊:Journal of Neural Engineering
影响因子:3.7
doi:10.1088/1741-2552/abf0d6
C Lamont, T Grego, K Nanbakhsh, A Shah Idil, V Giagka, A Vanhoestenberghe, S Cogan, N Donaldson
信号转导
发表日期：2021
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Realizing flexible bioelectronic medicines for accessing the peripheral nerves - technology considerations

实现用于外周神经通路的柔性生物电子药物——技术考量

期刊:Bioelectronic Medicine
影响因子:
doi:10.1186/s42234-018-0010-y
Giagka, Vasiliki; Serdijn, Wouter A
信号转导
神经科学
发表日期：2018
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