A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles.
分级短微针杯状双放大贴片可实现细胞外囊泡的加速、均匀、无痛透皮递送
期刊:Nano-Micro Letters
影响因子:36.3
doi:10.1007/s40820-025-01853-7
Song Minwoo, Ha Minji, Shin Sol, Kim Minjin, Son Soyoung, Lee Jihyun, Hwang Gui Won, Kim Jeongyun, Duong Van Hieu, Park Jae Hyung, Pang Changhyun
