Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF4/O2 Plasma for Semiconductor Multilevel Interconnects
用于半导体多层互连的等离子体聚合低介电常数薄膜在 CF4/O2 等离子体中蚀刻后电气/机械性能的变化
期刊:Materials
影响因子:
doi:10.3390/ma16134663
Namwuk Baek, Yoonsoo Park, Hyuna Lim, Jihwan Cha, Taesoon Jang, Shinwon Kang, Seonhee Jang, Donggeun Jung
