Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
采用压缩屈曲工艺制造的三维硅电子系统
期刊:ACS Nano
影响因子:16
doi:10.1021/acsnano.8b00180
Kim, Bong Hoon; Lee, Jungyup; Won, Sang Min; Xie, Zhaoqian; Chang, Jan-Kai; Yu, Yongjoon; Cho, Youn Kyoung; Jang, Hokyung; Jeong, Ji Yoon; Lee, Yechan; Ryu, Arin; Kim, Do Hoon; Lee, Kun Hyuck; Lee, Jong Yoon; Liu, Fei; Wang, Xueju; Huo, Qingze; Min, Seunghwan; Wu, Di; Ji, Bowen; Banks, Anthony; Kim, Jeonghyun; Oh, Nuri; Jin, Hyeong Min; Han, Seungyong; Kang, Daeshik; Lee, Chi Hwan; Song, Young Min; Zhang, Yihui; Huang, Yonggang; Jang, Kyung-In; Rogers, John A