Reconciliation of wheat 660K and 90K SNP arrays and their utilization in dough rheological properties of bread wheat
小麦660K和90K SNP芯片的整合及其在面包小麦面团流变学特性中的应用
期刊:Journal of Advanced Research
影响因子:13
doi:10.1016/j.jare.2025.01.011
Sun, Congwei; Jing, Zhenhai; Chen, Xiaoqian; Chen, Jiahui; Shang, Qiaoqiao; Jin, Hui; Jia, Jizeng; Ren, Yan; Zhao, Lei; Gao, Lifeng; He, Zhonghu; Chen, Feng
