Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias
基于方锥体硅通孔的功率芯片基板内嵌散热结构分析与验证
期刊:Micromachines
影响因子:
doi:10.3390/mi15030323
Fengjie Guo, Kui Ma, Jingyang Ran, Fashun Yang
