Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness
采用纳米锁定技术实现半导体芯片的电互连和键合，键合线厚度超薄
期刊:Nanomaterials
影响因子:4.3
doi:10.3390/nano11081901
Guo, Jielin; Shih, Yu-Chou; Sheikhi, Roozbeh; You, Jiun-Pyng; Shi, Frank G
