Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
将二维薄膜热成型为三维电子器件,用于高性能、可定制的触觉传感。
期刊:Science Advances
影响因子:12.5
doi:10.1126/sciadv.adv0057
Choi, Jungrak; Han, Chankyu; Lee, Donho; Kim, Hyunjin; Lee, Gihun; Ha, Ji-Hwan; Jeong, Yongrok; Ahn, Junseong; Park, Hyunkyu; Han, Hyeonseok; Cho, Seokjoo; Gu, Jimin; Park, Inkyu