Crack propagation and fracture in silicon wafers under thermal stress.
热应力作用下硅晶片的裂纹扩展和断裂
期刊:Journal of Applied Crystallography
影响因子:2.8
doi:10.1107/S0021889813003695
Danilewsky Andreas, Wittge Jochen, Kiefl Konstantin, Allen David, McNally Patrick, Garagorri Jorge, Elizalde M Reyes, Baumbach Tilo, Tanner Brian K
