Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications.
用于毫米波应用的玻璃基板集成波导，带有真空填充锡通孔
期刊:Micromachines
影响因子:3
doi:10.3390/mi16010012
Chung Seung-Han, Yeom Ho-Sun, Kim Che-Heung, Kim Yong-Kweon, Lee Seung-Ki, Baek Chang-Wook, Park Jae-Hyoung
