日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Superimposed intraoperative neuromonitoring for epidermoid cyst: Two-dimensional operative video

表皮囊肿术中神经监测叠加:二维手术视频

Morisaki, Yudai; Matsuda, Ryosuke; Kim, Tae-Kyun; Yamada, Kengo; Takatani, Tsunenori; Nakagawa, Ichiro

Temporal recovery in motor evoked potential during evacuation of cervical spontaneous epidural hematoma: illustrative case

颈椎自发性硬膜外血肿清除术中运动诱发电位的时间恢复:病例分析

Matsuoka, Ryuta; Takeshima, Yasuhiro; Takatani, Tsunenori; Morisaki, Yudai; Kim, Tae-Kyun; Yokoyama, Shohei; Hayashi, Hironobu; Matsuda, Ryosuke; Park, Young-Soo; Kawaguchi, Masahiko; Nakagawa, Ichiro

Analysis of interaction effect between within- and between-subject factors in repeated measures analysis of variance for longitudinal data

对纵向数据的重复测量方差分析中被试内因素和被试间因素的交互作用进行分析

Kim, Jonghae; Park, Jae Hong; Kim, Tae Kyun

Beyond the Bone: Why Orthopaedics Matters in the Super-aged Era

超越骨骼:为什么骨科在超老龄化时代如此重要

Kim, Tae Kyun

Incidence and risk factors of immune checkpoint inhibitor-induced colitis in Korean patients with cancer

韩国癌症患者免疫检查点抑制剂诱发结肠炎的发生率和危险因素

Kim, Tae Kyun; Lee, Hyun Seok; Kim, Eun Soo

In This Issue on 12-May-2025

本期内容(2025年5月12日)

Kim, Tae-Kyun; Lee, Jong Seok; Phi, Ji Hoon; Choi, Seung Ah; Kim, Joo Whan; Park, Chul-Kee; Yun, Hongseok; Park, Young-Soo; Park, Sung-Hye; Kim, Seung-Ki; Yoo, Jin-Hong

Clinical and Genetic Overview of Neurofibromatosis Type 2 (NF2)

2型神经纤维瘤病(NF2)的临床和遗传概述

Kim, Tae-Kyun; Park, Young-Soo; Nakagawa, Ichiro

The incidences of nausea and vomiting after general anesthesia with remimazolam versus sevoflurane: a prospective randomized controlled trial

瑞米唑仑与七氟醚全身麻醉后恶心呕吐发生率的前瞻性随机对照试验

Yoo, Yeong Min; Park, Jae Hong; Lee, Ki Hwa; Yi, Ah Hyeon; Kim, Tae Kyun

Optimal Indocyanine Green Dosage for Repetitive Angiography for Laparoscopic Colorectal Surgery

腹腔镜结直肠手术重复血管造影的最佳吲哚菁绿剂量

Son, Gyung Mo; Park, Sang-Ho; Kim, Nam Su; Yun, Mi Sook; Lee, In Young; Kwon, Myeong-Sook; Kim, Tae Kyun; Lee, Eun Hwa; Hwang, Eun Jung; Baek, Kwang-Ryul

Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing

用于半导体封装测试的三维微机电系统同轴插座器件的制造与表征

Kim, Tae-Kyun; Yook, Jong-Gwan; Kim, Joo-Yong; Cho, Yong-Ho; Lee, Uh-Hyeon