日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Direct Growth of Transparent Boron Nitride Neutron Shielding Layer for Space Window

用于太空窗口的透明氮化硼中子屏蔽层的直接生长

Kim, Dobin; Kim, Geunpil; Jeong, Hwijoon; Hossain, Sk Mujaffar; Bhattacharjee, Satadeep; Kwon, Minjae Isaac; Lee, Yeunjeong; Yang, Chanhee; Ham, Yeong Seok; Kim, Taek-Soo; Moon, Hyowon; Park, Inkyu; Lee, Seung-Cheol; Kim, Jinhwan; Kim, Jongbum; Park, Jaehyun

First Report of Concurrent Infective Endocarditis and Spondylitis Caused by Lactococcus petauri

首例由佩塔氏乳球菌引起的并发感染性心内膜炎和脊柱炎的病例报告

Ryu, Kyeong Seon; Kim, Taek Soo; Shin, Sue; Park, Jae Hyeon

Reciprocal folding dynamics in cellular networks at the stroma-basement membrane interface.

基质-基底膜界面细胞网络中的相互折叠动力学

Jo Youngmin, Yim Donghyun, Park Chan E, Yong Insung, Lee Jongbeom, Ahn Kwang Ho, Yang Chanhee, Chang Jae-Byum, Kim Taek-Soo, Shin Jennifer Hyunjong, Kim Taeyoon, Kim Pilnam

Direct Tensile Testing of Free-Standing Ultrathin Polymer Films on Liquid Surface at High Temperature

高温下液体表面上自支撑超薄聚合物薄膜的直接拉伸试验

Lee, Tae-Ik; Kim, Ji Hun; Oh, Eun Sung; Kim, Taek-Soo

Bacteremia Caused by a Putative Novel Species in the Genus Erwinia: A Case Report and Genomic Analysis

由疑似欧文氏菌属新种引起的菌血症:病例报告及基因组分析

Lee, Jiwoo; Kim, Taek Soo; Park, Hyunwoong; Park, Jae Hyeon

3D printable and biocompatible PEDOT:PSS-ionic liquid colloids with high conductivity for rapid on-demand fabrication of 3D bioelectronics

可 3D 打印且生物相容性的高导电性 PEDOT:PSS-离子液体胶体,可用于快速按需制造 3D 生物电子器件

Byungkook Oh #, Seunghyeok Baek #, Kum Seok Nam #, Changhoon Sung, Congqi Yang, Young-Soo Lim, Min Sang Ju, Soomin Kim, Taek-Soo Kim, Sung-Min Park, Seongjun Park, Steve Park

Spectrin mediates 3D-specific matrix stress-relaxation response in neural stem cell lineage commitment

Spectrin介导神经干细胞谱系定向过程中三维特异性基质应力松弛反应。

Qiao, Eric; Baek, Jieung; Fulmore, Camille; Song, Myoung; Kim, Taek-Soo; Kumar, Sanjay; Schaffer, David V

Delay in the diagnosis of Brucella abortus bacteremia in a nonendemic country: a case report

非流行国家布鲁氏菌菌血症诊断延误:病例报告

Park, Jae Hyeon; Kim, Taek Soo; Park, Hyunwoong; Kang, Chang Kyung

Universal selective transfer printing via micro-vacuum force

利用微真空力进行通用选择性转移印刷

Park, Sang Hyun; Kim, Tae Jin; Lee, Han Eol; Ma, Boo Soo; Song, Myoung; Kim, Min Seo; Shin, Jung Ho; Lee, Seung Hyung; Lee, Jae Hee; Kim, Young Bin; Nam, Ki Yun; Park, Hong-Jin; Kim, Taek-Soo; Lee, Keon Jae

Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

通过改进固化周期降低粘合温度,从而提升电子封装性能

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L; Kim, Seong Su