Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam Heating
利用SnSbTi基焊料和电子束加热技术研究SiC陶瓷和Ni-SiC复合材料焊点的润湿性
期刊:Materials
影响因子:3.2
doi:10.3390/ma18122814
Melus, Tomas; Kolenak, Roman; Drapala, Jaromir; Gogola, Peter; Pasak, Matej; Drimal, Daniel; Sloboda, Mikulas
