日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

利用原位3D纳米光刻技术实现光通信引擎的混合多芯片组装

Blaicher, Matthias; Billah, Muhammad Rodlin; Kemal, Juned; Hoose, Tobias; Marin-Palomo, Pablo; Hofmann, Andreas; Kutuvantavida, Yasar; Kieninger, Clemens; Dietrich, Philipp-Immanuel; Lauermann, Matthias; Wolf, Stefan; Troppenz, Ute; Moehrle, Martin; Merget, Florian; Skacel, Sebastian; Witzens, Jeremy; Randel, Sebastian; Freude, Wolfgang; Koos, Christian

Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulators for 100 Gbit/s on-off Keying

用于 100 Gbit/s 开关键控的硅-有机混合 (SOH) 马赫-曾德尔调制器

Wolf, Stefan; Zwickel, Heiner; Hartmann, Wladislaw; Lauermann, Matthias; Kutuvantavida, Yasar; Kieninger, Clemens; Altenhain, Lars; Schmid, Rolf; Luo, Jingdong; Jen, Alex K-Y; Randel, Sebastian; Freude, Wolfgang; Koos, Christian