Patterning of Lead Halide Perovskite Device Stacks on CMOS Readout Using Selective Microfabrication Protocols
利用选择性微加工技术在CMOS读出层上形成卤化铅钙钛矿器件堆叠图案
期刊:Advanced Materials
影响因子:26.8
doi:10.1002/adma.202523002
Tsarev, Sergey; Wu, Erfu; Cho, Kyuik; Liu, Xuqi; Lung, Quang Nhat Dang; Hartman, Emeric; Sun, Tian; Turedi, Bekir; Matt, Gebhard J; Frick, Stefanie; Siol, Sebastian; Jang, Taekwang; Shorubalko, Ivan; Yakunin, Sergii; Kovalenko, Maksym V
