ASPL couples the assembly of stress granules with their VCP-mediated disassembly
ASPL将应力颗粒的组装与其VCP介导的解体联系起来
期刊:Science Advances
影响因子:12.5
doi:10.1126/sciadv.ady3735
Pareek, Gautam; Li, Dongfang; Wang, Bo; Wu, Jinjun; Freibaum, Brian D; Basalla, Joseph L; Mahendran, Tharun Selvam; Singh, Anurag; Nourse, Amanda; Quan, Honghu; Kalathur, Ravi; Rana, Mitra S; Maxwell, Brian; Wang, Yong-Dong; Messing, James; Ni, Yonghui; Pounds, Stanley; Dharmat, Rachayata; Lu, Jingjun; Li-Harms, Xiujie; Carisey, Alexandre F; Pruett-Miller, Shondra M; Taylor, J Paul; Banerjee, Priya; Kim, Hong Joo; Kundu, Mondira