Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding
界面工程抑制电镀纳米晶铜的自退火,用于低温铜-铜键合
期刊:Advanced Science
影响因子:14.1
doi:10.1002/advs.202521964
Peng, Gangqiang; Dong, Xinyi; Li, Binzhao; He, Chuan; Chen, Cong; Huang, Licheng; Liu, Jian; Zhou, Yonghan; Li, Qikai; Gong, Hao; Wang, Yuechen; Mu, Kaiyu; Cherng, Sheng-Jye; Yang, Po-Yen; Lu, Yang; Yang, Yong; Hung, Shih-Wei; Feng, Shien-Ping