Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
凹坑微纹理铜基材对Sn-0.7Cu焊料合金性能的影响
期刊:Materials
影响因子:
doi:10.3390/ma16010096
Siti Faqihah Roduan, Juyana A Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu, Petrica Vizureanu
