Electrodeposition of nanowires of a high copper content thiourea precursor of copper sulfide
采用高铜含量硫脲前驱体电沉积硫化铜纳米线
期刊:RSC Advances
影响因子:4.6
doi:10.1039/c9ra04293h
Sarma, Abhisakh; Dippel, Ann-Christin; Gutowski, Olof; Etter, Martin; Lippmann, Milena; Seeck, Oliver; Manna, Gouranga; Sanyal, Milan K; Keller, Thomas F; Kulkarni, Satishkumar; Guha, Puspendu; Satyam, Parlapali V; Zimmermann, Martin V
