Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
扇出型晶圆和面板级封装作为异构集成的封装平台
期刊:Micromachines
影响因子:
doi:10.3390/mi10050342
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
