Thermally Induced Creep and Viscoelastic Behavior of Copper Micropillar Arrays
铜微柱阵列的热致蠕变和粘弹性行为
期刊:Advanced Science
影响因子:14.1
doi:10.1002/advs.202519178
Wang, Miao; Zhang, Jihua; Gao, Libin; Chen, Hongwei; Luo, Wenbo; Li, Wenlei; Chen, Mingcheng; Li, Mengru; Wang, Dongbin; Li, Shuang; Liu, Ting; Cai, Xingzhou; Li, Yong; Peng, Bin; Zhang, Wanli