Damage-Free Full-Thickness Dicing of Ultra-Thin GaAs Wafers Using a Femtosecond Laser with Low Residual Stress
利用飞秒激光对超薄GaAs晶片进行无损伤全厚度切割,残余应力低
期刊:Advanced Science
影响因子:14.1
doi:10.1002/advs.202515347
Cai, Shunshuo; Ding, Yankang; Ding, Minxia; Song, Qi; Zhang, Zhe; Zhang, Siwei; Zhang, Kunpeng; Hou, Yu; Yue, Song; Shi, Haiyan; Li, Man; Duan, Wenrui; Zhang, Zichen