Correction: Nimbalkar et al. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895
更正：Nimbalkar 等人，《用于中介层和封装基板中重分布层的聚合物介电材料综述》，《聚合物》2023，15，3895
期刊:Polymers
影响因子:4.9
doi:10.3390/polym16192751
Nimbalkar, Pratik; Bhaskar, Pragna; Kathaperumal, Mohanalingam; Swaminathan, Madhavan; Tummala, Rao R
