Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
等温退火对Sn0.7Cu0.05Ni焊点Sn晶须生长行为的影响
期刊:Materials
影响因子:
doi:10.3390/ma16051852
Aimi Noorliyana Hashim, Mohd Arif Anuar Mohd Salleh, Muhammad Mahyiddin Ramli, Mohd Mustafa Al Bakri Abdullah, Andrei Victor Sandu, Petrica Vizureanu, Ioan Gabriel Sandu
