日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Multiphysics-Driven Assembly of Biomimetic Vesicles

多物理场驱动的仿生囊泡组装

Solodko, Timofei; Gimino, Ian; Chandiwala, Aastha; Alkotoub, Bayan; Bashiri Dezfouli, Ali; Reith, Heiko; Bakhtiar, Asjad; Hicsanmaz, Rojda; Brenner, Johann; Kaiser, Christoph J O; Belli, Elena; Pandey, Shilpi; Rabkin, Samuel D; Nielsch, Kornelius; Multhoff, Gabriele; Hayden, Oliver; Hasanzadeh Kafshgari, Morteza

Finite Size-Effects in Martensite Microstructure of Magnetic Shape Memory Films

磁性形状记忆薄膜马氏体微观结构的有限尺寸效应

Kar, Satyakam; Singh, Aman; Nielsch, Kornelius; Reith, Heiko; Fähler, Sebastian

Reduced Lattice Thermal Conductivity in Thermoelectric α-MgAgSb via Sb(2)Te(3) Powder Atomic Layer Deposition

通过Sb(2)Te(3)粉末原子层沉积降低热电材料α-MgAgSb的晶格热导率

García Santamaría, Irene; Bahrami, Amin; Wrzesińska-Lashkova, Angelika; Charvot, Jaroslav; Sotnikov, Andrei; Giebeler, Lars; Vaynzof, Yana; Bureš, Filip; Ying, Pingjun; Nielsch, Kornelius

Advances in MgAgSb thermoelectrics: from materials to devices

MgAgSb热电材料的研究进展:从材料到器件

Xie, Liangjun; He, Ran; Sui, Jiehe; Nielsch, Kornelius; Liu, Zihang

Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental Bismuth

低温原子层沉积法制备(00l)取向的元素铋

Vazquez-Arce, Jorge Luis; Amoroso, Alessio; Perez, Nicolas; Charvot, Jaroslav; Naglav-Hansen, Dominik; Zhao, Panpan; Yang, Jun; Lehmann, Sebastian; Wrzesińska-Lashkova, Angelika; Pieck, Fabian; Tonner-Zech, Ralf; Bureš, Filip; Acquesta, Annalisa; Vaynzof, Yana; Devi, Anjana; Nielsch, Kornelius; Bahrami, Amin

Printed Conformal and Transparent Magnetoresistive Sensors for Seamless Integration and Environment-Resilient Touchless Interaction

用于无缝集成和环境适应性非接触式交互的印刷式共形透明磁阻传感器

Xu, Rui; Oliveros Mata, Eduardo Sergio; Cheng, Fei; Pylypovskyi, Oleksandr V; Zhang, Qihao; Das, Proloy Taran; Zabila, Yevhen; Bezsmertna, Olha; Yang, Jun; Wang, Xiaotao; Lehmann, Sebastian; Guo, Lin; Hübner, René; Ganss, Fabian; He, Ran; Illing, Rico; Nielsch, Kornelius; Makarov, Denys

High-performance ZrNiSn-based half-Heusler thermoelectrics with hierarchical architectures enabled by reactive sintering

利用反应烧结技术制备具有分级结构的高性能ZrNiSn基半赫斯勒热电材料

Ai, Xin; Wu, Yu; Lyu, Haiyan; Giebeler, Lars; Xue, Wenhua; Sotnikov, Andrei; Wang, Yumei; Zhang, Qihao; Makarov, Denys; Yu, Yuan; Snyder, G Jeffrey; Nielsch, Kornelius; He, Ran

Preserving the Josephson Coupling of Twisted Cuprate Junctions via Tailored Silicon Nitride Circuits Boards

通过定制氮化硅电路板保持扭曲铜酸盐结的约瑟夫森耦合

Confalone, Tommaso; Lo Sardo, Flavia; Montemurro, Domenico; Massarotti, Davide; Vinokur, Valerii M; Gu, Genda; Tafuri, Francesco; Nielsch, Kornelius; Haider, Golam; Poccia, Nicola

Exploring van der Waals Cuprate Superconductors Using a Hybrid Microwave Circuit

使用混合微波电路探索范德华铜酸盐超导体

Jin, Haolin; Serpico, Giuseppe; Lee, Yejin; Confalone, Tommaso; Saggau, Christian N; Lo Sardo, Flavia; Gu, Genda; Goodge, Berit H; Lesne, Edouard; Montemurro, Domenico; Nielsch, Kornelius; Poccia, Nicola; Vool, Uri

On the Origin of Temperature Induced Performance Degradation of Cu-Contacted Mg(2)X-Based (X = Si, Sn) Thermoelectric Materials

关于铜接触Mg₂X基(X = Si, Sn)热电材料温度诱导性能退化的成因

Deshpande, Radhika; Bahrami, Amin; Kreps, Frederic; He, Ran; Ying, Pingjun; Nielsch, Kornelius; Müller, Eckhard; de Boor, Johannes