日期 影响因子
日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:
–

A numerical approach to bio-mechanics analysis based on live micro-CT images in the rat temporomandibular joint

基于大鼠颞下颌关节活体微型CT图像的生物力学分析数值方法

期刊:Computational and Structural Biotechnology Journal
影响因子:4.1
doi:10.1016/j.csbj.2025.07.002
Chen, Chia-Chun; Trang, Tran-Thi-Ngoc; Wang, Ding-Han; Tsou, Nien-Ti
Rat
发表日期：2025
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Optimizing dental implant design: Structure, strength, and bone ingrowth

优化种植牙设计：结构、强度和骨长入

期刊:Journal of Dental Sciences
影响因子:3.1
doi:10.1016/j.jds.2024.11.024
Chang, Jenny Zwei-Chieng; Hsu, Jui-Ting; Li, Ming-Jun; Lin, Hung-Ying; Sun, Jason; Tsou, Nien-Ti; Sun, Jui-Sheng
发表日期：2025
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In Vivo Study of Bone Growth Around Additively Manufactured Implants With Ti-6Al-4V and Bioactive Glass Powder Composites

采用Ti-6Al-4V和生物活性玻璃粉复合材料增材制造植入物周围骨生长的体内研究

期刊:Journal of Orthopaedic Research
影响因子:2.3
doi:10.1002/jor.70037
Lee, Chih-Yu; Kung, Pei-Ching; Huang, Chih-Chieh; Shih, Shao-Ju; Huang, E-Wen; Chen, San-Yuan; Wu, Meng-Huang; Tsou, Nien-Ti
发表日期：2025
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Effect of serrated grain boundary on tensile and creep properties of a precipitation strengthened high entropy alloy

锯齿状晶界对沉淀强化高熵合金拉伸和蠕变性能的影响

期刊:Science and Technology of Advanced Materials
影响因子:6.9
doi:10.1080/14686996.2022.2158043
Lee, Jhuo-Lun; Wang, Pei-Te; Lo, Kai-Chi; Shen, Pai-Keng; Tsou, Nien-Ti; Kakehi, Koji; Murakami, Hideyuki; Tsai, Che-Wei; Gorsse, Stéphane; Yeh, An-Chou
发表日期：2023
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Prediction of Bone Healing around Dental Implants in Various Boundary Conditions by Deep Learning Network

利用深度学习网络预测不同边界条件下牙种植体周围骨愈合情况

期刊:International Journal of Molecular Sciences
影响因子:4.9
doi:10.3390/ijms24031948
Kung, Pei-Ching; Hsu, Chia-Wei; Yang, An-Cheng; Chen, Nan-Yow; Tsou, Nien-Ti
发表日期：2023
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Mechanical performance of porous biomimetic intervertebral body fusion devices: an in vitro biomechanical study

多孔仿生椎间融合装置的力学性能：一项体外生物力学研究

期刊:Journal of Orthopaedic Surgery and Research
影响因子:2.8
doi:10.1186/s13018-023-03556-4
Tsuang, Fon-Yih; Li, Ming-Jun; Chu, Po-Han; Tsou, Nien-Ti; Sun, Jui-Sheng
发表日期：2023
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Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu joints

通过再结晶和晶粒长大来增强抗疲劳性能，从而消除铜-铜接头中的结合界面

期刊:Scientific Reports
影响因子:3.9
doi:10.1038/s41598-022-16957-y
Ong, Jia-Juen; Tran, Dinh-Phuc; Lan, Man-Chi; Shie, Kai-Cheng; Hsu, Po-Ning; Tsou, Nien-Ti; Chen, Chih
发表日期：2022
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Failures of Cu-Cu Joints under Temperature Cycling Tests

铜-铜接头在温度循环试验中的失效

期刊:Materials
影响因子:3.2
doi:10.3390/ma15144944
Hsu, Po-Ning; Shie, Kai-Cheng; Tran, Dinh-Phuc; Tsou, Nien-Ti; Chen, Chih
发表日期：2022
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Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

锡晶粒取向对锡银焊点中镍金属化层电迁移诱导溶解的影响

期刊:Materials
影响因子:3.2
doi:10.3390/ma15207115
Hsu, Po-Ning; Lee, Dai-Lung; Tran, Dinh-Phuc; Shie, Kai-Cheng; Tsou, Nien-Ti; Chen, Chih
发表日期：2022
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Deformations of Ti-6Al-4V additive-manufacturing-induced isotropic and anisotropic columnar structures: Insitu measurements and underlying mechanisms

Ti-6Al-4V增材制造诱导的各向同性和各向异性柱状结构的变形：原位测量和潜在机制

期刊:Additive Manufacturing
影响因子:11.1
doi:10.1016/j.addma.2020.101322
Tseng, Jo-Chi; Huang, Wei-Chin; Chang, Wei; Jeromin, Arno; Keller, Thomas F; Shen, Jun; Chuang, Andrew Chihpin; Wang, Chun-Chieh; Lin, Bi-Hsuan; Amalia, Lia; Tsou, Nien-Ti; Shih, Shao-Ju; Huang, E-Wen
发表日期：2020
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