Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
高压微冷却器件阳极和金-金热压硅晶片键合方法的比较
期刊:Micromachines
影响因子:3
doi:10.3390/mi14071297
Bargiel Sylwester, Cogan Julien, Queste Samuel, Oliveri Stefania, Gauthier-Manuel Ludovic, Raschetti Marina, Leroy Olivier, Beurthey Stéphan, Perrin-Terrin Mathieu
