Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process
采用 300 毫米 CMOS 代工工艺制造的高度均匀的热蚀刻硅光子器件
期刊:Scientific Reports
影响因子:3.9
doi:10.1038/s41598-025-14480-4
Parsons, Robert; Jang, Kaylx; Wang, Yuyang; Novick, Asher; Smith, A Matthew; Tison, Christopher C; Gebregiorgis, Yonas; Deenadayalan, Venkatesh; Niekerk, Matthew van; Carpenter, Lewis; Ngai, Tat; Leake, Gerald; Coleman, Daniel; Meng, Xiang; Preble, Stefan; Fanto, Michael L; Bergman, Keren; Rizzo, Anthony