Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density
下一代3D微电子器件工程的挑战与机遇:性能提升和集成度提高
期刊:Nanoscale Advances
影响因子:4.6
doi:10.1039/d4na00578c
Singh, Niharika; Srivastava, Kingshuk; Kumar, Ajay; Yadav, Neha; Yadav, Ashish; Dubey, Santosh; Singh, Rajesh; Gehlot, Anita; Verma, Ajay Singh; Gupta, Neha; Kumar, Tanuj; Wu, Yongling; Hongyu, Zheng; Mondal, Aniruddha; Pandey, Kailash; Brajpuriya, Ranjeet; Kumar, Shalendra; Gupta, Rajeev