Strain-engineering Mott-insulating La(2)CuO(4)
应变工程莫特绝缘体 La(2)CuO(4)
期刊:Nature Communications
影响因子:15.7
doi:10.1038/s41467-019-08664-6
Ivashko, O; Horio, M; Wan, W; Christensen, N B; McNally, D E; Paris, E; Tseng, Y; Shaik, N E; Rønnow, H M; Wei, H I; Adamo, C; Lichtensteiger, C; Gibert, M; Beasley, M R; Shen, K M; Tomczak, J M; Schmitt, T; Chang, J