In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy
利用高压透射电子显微镜对Sn-3Ag-0.5Cu/Cu焊点形变进行原位观察
期刊:Materials
影响因子:3.2
doi:10.3390/ma18163925
Nogita, Kazuhiro; Tan, Xin Fu; Zhou, Jiye; McDonald, Stuart D; Sweatman, Keith; Somidin, Flora; Zeng, Guang; Maeno, Hiroshi; Yasuda, Kazuhiro; Gourlay, Christopher M