日期 影响因子
日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:
–

Influence of Inlet Splitter Structure on Flow and Heat Transfer Performance in Microchannel Heat Exchangers

入口分流器结构对微通道换热器流动和传热性能的影响

期刊:Micromachines
影响因子:3
doi:10.3390/mi17020275
Tian, Wenchao; Xi, Yuanyuan; Li, Shuaike; Li, Feiyang; Wang, Yifan; Dang, Haojie; Chen, Si
发表日期：2026
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Damage Mechanism Analysis of High Field Stress on Cascode GaN HEMT Power Devices

高场应力对共源共栅GaN HEMT功率器件的损伤机理分析

期刊:Micromachines
影响因子:3
doi:10.3390/mi16070729
Su, Shuo; Cao, Yanrong; Zhang, Weiwei; Zhang, Xinxiang; Chen, Chuan; Wu, Linshan; Zhang, Zhixian; Li, Miaofen; Lv, Ling; Zheng, Xuefeng; Tian, Wenchao; Ma, Xiaohua; Hao, Yue
发表日期：2025
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Cam Design and Pin Defect Detection of Cam Pin Insertion Machine in IGBT Packaging

IGBT封装用凸轮销插入机的凸轮设计及销缺陷检测

期刊:Micromachines
影响因子:3
doi:10.3390/mi16070829
Tian, Wenchao; Zhang, Pengchao; Tian, Mingfang; Chen, Si; Ji, Haoyue; Ma, Bingxu
发表日期：2025
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Intrauterine ovarian torsion with autoamputation and intra-abdominal wandering mass: a report of three cases and literature review

宫内卵巢扭转伴卵巢自体截断及腹腔内游走性肿块：三例报告及文献复习

期刊:Frontiers in Medicine
影响因子:3
doi:10.3389/fmed.2025.1509477
Liu, Xinxing; Ding, Guojian; Tian, Wenchao; Liu, Xijie; Fu, Tingliang; Liu, Hongzhen; Xu, Aiqun; Han, Xinling; Feng, Wenyu; Geng, Lei
发表日期：2025
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Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration.

复杂PCB组件在温度循环和随机振动下的可靠性分析

期刊:Micromachines
影响因子:3
doi:10.3390/mi16020212
Tian Wenchao, Li Feiyang, He Mang, Ji Haoyue, Chen Si
其它
发表日期：2025
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Study on Single Event Effects of Enhanced GaN HEMT Devices under Various Conditions

研究增强型GaN HEMT器件在不同条件下的单粒子效应

期刊:Micromachines
影响因子:3
doi:10.3390/mi15080950
Zhang, Xinxiang; Cao, Yanrong; Chen, Chuan; Wu, Linshan; Wang, Zhiheng; Su, Shuo; Zhang, Weiwei; Lv, Ling; Zheng, Xuefeng; Tian, Wenchao; Ma, Xiaohua; Hao, Yue
发表日期：2024
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The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section Groove

液态金属液滴在变截面沟槽中连续加速下的变形

期刊:Micromachines
影响因子:3
doi:10.3390/mi15121472
Xu, Hanyang; Dang, Haojie; Tian, Wenchao; Li, Zhao
发表日期：2024
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Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling

硅中介层中TSV结构在温度循环下的可靠性仿真分析

期刊:Micromachines
影响因子:3
doi:10.3390/mi15080986
Tian, Wenchao; Dang, Haojie; Li, Dexin; Cong, Yunhao; Chen, Yuanming
发表日期：2024
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Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging

纳米银无压烧结工艺在碳化硅功率器件封装中的残余应力和翘曲分析

期刊:Micromachines
影响因子:3
doi:10.3390/mi15091087
Tian, Wenchao; Li, Dexin; Dang, Haojie; Liang, Shiqian; Zhang, Yizheng; Zhang, Xiaojun; Chen, Si; Yu, Xiaochuan
发表日期：2024
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Progress in Research on Co-Packaged Optics

共封装光学器件研究进展

期刊:Micromachines
影响因子:3
doi:10.3390/mi15101211
Tian, Wenchao; Hou, Huahua; Dang, Haojie; Cao, Xinxin; Li, Dexin; Chen, Si; Ma, Bingxu
发表日期：2024
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