日期 影响因子
日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:
–

Integrated Strategies for Overcoming Resolution Limits in Electron Beam Lithography of Chemically Amplified Resists

克服化学放大光刻胶电子束光刻分辨率限制的综合策略

期刊:ACS Applied Materials & Interfaces
影响因子:8.2
doi:10.1021/acsami.5c18774
Wu, Xinpei; Tiwale, Nikhil; Stein, Aaron; Nam, Chang-Yong
发表日期：2026
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Alumina Priming-Mediated Enhanced Binding of Diethylzinc with Carbonyl Groups in Poly(Methyl Methacrylate) during Vapor-Phase Infiltration

氧化铝底涂介导的二乙基锌与聚甲基丙烯酸甲酯中羰基在气相渗透过程中的增强结合

期刊:Chemistry of Materials
影响因子:7
doi:10.1021/acs.chemmater.5c02584
Tiwale, Nikhil; Subramanian, Ashwanth; Sikder, Sayantani; Qu, Xiaohui; Freychet, Guillaume; Gann, Eliot; Jaye, Cherno; Kisslinger, Kim; Boscoboinik, Jorge Anibal; Nam, Chang-Yong
发表日期：2026
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Mechanism of Vapor-Phase Infiltration of Organometallic Hf in Poly(Methyl Methacrylate) for Hybrid Resist Applications

有机金属Hf气相渗入聚甲基丙烯酸甲酯的机理及其在混合光刻胶应用中的应用

期刊:Chemistry of Materials
影响因子:7
doi:10.1021/acs.chemmater.5c02369
Chowdhury, Md Istiaque; Wu, Xinpei; Lee, Won-Il; Sun, Peter; Ahmad, Mueed; Kisslinger, Kim; Sadowski, Jerzy T; Tenney, Samuel A; Boscoboinik, Jorge Anibal; Tiwale, Nikhil; Nam, Chang-Yong
发表日期：2026
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Macroscale-area patterning of three-dimensional DNA-programmable frameworks

三维DNA可编程框架的宏观区域图案化

期刊:Nature Communications
影响因子:15.7
doi:10.1038/s41467-025-58422-0
Teng, Feiyue; Zhang, Honghu; Nykypanchuk, Dmytro; Li, Ruipeng; Yang, Lin; Tiwale, Nikhil; Xi, Zhaoyi; Liu, Mingzhao; He, Mingxin; Zhang, Shuai; Gang, Oleg
发表日期：2025
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Scalable fabrication of Chip-integrated 3D-nanostructured electronic devices via DNA-programmable assembly

利用DNA可编程组装技术实现芯片集成3D纳米结构电子器件的可扩展制造

期刊:Science Advances
影响因子:12.5
doi:10.1126/sciadv.adt5620
Michelson, Aaron; Shani, Lior; Kahn, Jason S; Redeker, Daniel C; Lee, Won-Il; DeOlivares, Katerina R; Kisslinger, Kim; Tiwale, Nikhil; Yan, Hanfei; Pattammattel, Ajith; Nam, Chang-Yong; Pribiag, Vlad S; Gang, Oleg
3D/类器官
发表日期：2025
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Approaching Angstrom-Scale Resolution in Lithography Using Low-Molecular-Mass Resists (<500 Da)

利用低分子量光刻胶（<500 Da）实现接近埃级分辨率的光刻技术

期刊:ACS Nano
影响因子:16
doi:10.1021/acsnano.4c03939
Saifullah, Mohammad S M; Rajak, Anil Kumar; Hofhuis, Kevin A; Tiwale, Nikhil; Mahfoud, Zackaria; Testino, Andrea; Karadan, Prajith; Vockenhuber, Michaela; Kazazis, Dimitrios; Valiyaveettil, Suresh; Ekinci, Yasin
发表日期：2024
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Three-dimensional nanoscale metal, metal oxide, and semiconductor frameworks through DNA-programmable assembly and templating

通过 DNA 可编程组装和模板制备三维纳米级金属、金属氧化物和半导体框架

期刊:Science Advances
影响因子:11.7
doi:10.1126/sciadv.adl0604
Aaron Michelson, Ashwanth Subramanian, Kim Kisslinger, Nikhil Tiwale, Shuting Xiang, Eric Shen, Jason S Kahn, Dmytro Nykypanchuk, Hanfei Yan, Chang-Yong Nam, Oleg Gang
发表日期：2024
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Priming self-assembly pathways by stacking block copolymers

通过堆叠嵌段共聚物来启动自组装途径

期刊:Nature Communications
影响因子:14.7
doi:10.1038/s41467-022-34729-0
Sebastian T Russell, Suwon Bae, Ashwanth Subramanian, Nikhil Tiwale, Gregory Doerk, Chang-Yong Nam, Masafumi Fukuto, Kevin G Yager
发表日期：2022
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Unilateral trigeminal motor nerve neuropathy

单侧三叉神经运动神经病变

期刊:Radiology Case Reports
影响因子:
doi:10.1016/j.radcr.2022.05.074
Nagure, Pramod; Urunkar, Bhaskar; Nikam, Vasudha; Tiwale, Sunita; Pawal, Sambhaji
发表日期：2022
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Author Correction: Nanofabrication of Conductive Metallic Structures on Elastomeric Materials

作者更正：弹性体材料上导电金属结构的纳米加工

期刊:Scientific Reports
影响因子:3.9
doi:10.1038/s41598-018-30954-0
Tan, Edward K W; Rughoobur, Girish; Rubio-Lara, Juan; Tiwale, Nikhil; Xiao, Zhuocong; Davidson, Colin A B; Lowe, Christopher R; Occhipinti, Luigi G
发表日期：2018
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