Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
微观结构对纳米级厚度铜膜在玻璃基板上界面粘附力的影响：对微电子器件的启示
期刊:ACS Applied Nano Materials
影响因子:5.5
doi:10.1021/acsanm.0c02182
Lassnig, Alice; Terziyska, Velislava L; Zalesak, Jakub; Jörg, Tanja; Toebbens, Daniel M; Griesser, Thomas; Mitterer, Christian; Pippan, Reinhard; Cordill, Megan J
