Impact of Bonding Temperature on Microstructure, Mechanical, and Fracture Behaviors of TLP Bonded Joints of Al2219 with a Cu Interlayer
键合温度对含铜中间层的Al2219合金TLP键合接头的微观结构、力学性能和断裂行为的影响
期刊:ACS Omega
影响因子:4.3
doi:10.1021/acsomega.3c02838
Vatnalmath, Manjunath; Auradi, Virupaxi; J, Varun Kumar M; Murthy, Bharath Vedashantha; Nagaral, Madeva; Pandian, A Anbarasa; Islam, Saiful; Khan, Mohammad Shahiq; Anjinappa, Chandrashekar; Razak, Abdul
