日期:
2020 年 — 2026 年
2020
2021
2022
2023
2024
2025
2026
影响因子:

Microstructural Modeling and Simulation of a Carbon Black-Based Conductive Polymer-A Template for the Virtual Design of a Composite Material

炭黑基导电聚合物的微观结构建模与仿真——复合材料虚拟设计的模板

Wang, Yuanzhen; Xu, Chensheng; Jahnke, Timotheus; Verestek, Wolfgang; Schmauder, Siegfried; Spatz, Joachim P

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

利用分子动力学模拟表征环氧树脂的固化行为,并与介电分析和差示扫描量热法进行比较。

Yan, Shuang; Verestek, Wolfgang; Zeizinger, Harald; Schmauder, Siegfried

Molecular Dynamics Simulation of High-Temperature Creep Behavior of Nickel Polycrystalline Nanopillars

镍多晶纳米柱高温蠕变行为的分子动力学模拟

Xu, Xiang; Binkele, Peter; Verestek, Wolfgang; Schmauder, Siegfried