Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu
低温低压下铜与铜通过电镀超细晶粒（UFG）铜直接键合的晶界运动
期刊:Scientific Reports
影响因子:3.9
doi:10.1038/s41598-025-17058-2
Lee, Yun-Fong; Chiu, Chih-Wen; Chiu, Chin-Yen; Huang, Yu-Chen; Lo, Mei-Hsin; Yang, Liu-Hsin-Chen; Cheng, Ting-Yi; Yu, Zhong-Yen; Hsu, Chih-En; Lin, Kai-Chi; Chen, Po-Yu; Huang, Wei-Cheih; Chang, Jui-Sheng; Pan, Shao-An; Su, Yi-Cheng; Lin, Chin-Li; Hsieh, Hang-Chen; Lin, Chia-Hua; Liu, Cheng-Yi
